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Semiconductor 3D Equipment and Materials Consortium (EMC-3D)

Overview: EMC3D (Semiconductor 3D Equipment and Materials Consortium) developed the market for 3D technology by demonstrating a cost-effective, manufacturable, stackable TSV interconnection process. TSV processes were developed for chip integration and MEMS/sensor packaging based on plated metal electrodes and thinned wafers. *Inactive

Specifications: Not Available

IPR Policy: Not Available

Current Status: Inactive

Last Updated: October 28, 2015

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