Semiconductor 3D Equipment and Materials Consortium (EMC-3D)
Overview: EMC3D (Semiconductor 3D Equipment and Materials Consortium) was created in September 2006 to develop a new 3D market and technology by demonstrating a cost-effective, manufacturable, stackable TSV interconnection process. TSV processes were developed for chip integration and MEMS/sensor packaging based on plated metal electrodes and thinned wafers.
Specifications: Not available
IPR Policy: Not available
Current Status: Inactive
Last Updated: January 2, 2014