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Semiconductor 3D Equipment and Materials Consortium (EMC-3D)

Overview: EMC3D (Semiconductor 3D Equipment and Materials Consortium) was created in September 2006 to develop a new 3D market and technology by demonstrating a cost-effective, manufacturable, stackable TSV interconnection process. TSV processes were developed for chip integration and MEMS/sensor packaging based on plated metal electrodes and thinned wafers.

Specifications: Not available

IPR Policy: Not available

Current Status: Inactive

Last Updated: January 2, 2014

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