Find out more about this
Gesmer Updegrove has represented more than 132 standards consortia and open source foundations, including:
View Full Client List
Useful Links

Communications Center Press Center Sitemap

Tools

Text Size:
Default  Large

RSS Feeds

Bookmark and Share

Standard Setting Organizations
and Standards List

Semiconductor 3D Equipment and Materials Consortium (EMC-3D)

Overview: EMC3D (Semiconductor 3D Equipment and Materials Consortium) was created in September 2006 to develop a new 3D market and technology by demonstrating a cost-effective, manufacturable, stackable TSV interconnection process. TSV processes were developed for chip integration and MEMS/sensor packaging based on plated metal electrodes and thinned wafers.

Specifications: Not available

IPR Policy: Not available

Current Status: Inactive

Last Updated: January 2, 2014


» Back to Complete List